About us
SILTECTRA sees itself as a technology specialist for kerf-less Wafering, a novel technology for the production of wafers. Kerf-less Wafering from SILTECTRA is a platform technology that can be used in a variety of industries and materials.
The SILTECTRA process can be used to divide monocrystalline materials such as silicon, gallium arsenide, gallium nitride, germanium or sapphire – without the loss of raw material as in sawing wafers.
Siltectra GmbH is an IP company that develops and licenses processes for manufacturers of semiconductor products. The processes are adapted to the customer’s production and integrated into the existing production processes.
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