About Sonix
Since 1986, Sonix has pioneered many of the breakthroughs in defect detection and process productivity that have helped semiconductor manufacturers create a world of new possibilities. Today, manufacturers around the world depend on our scanning acoustic microscope technology for nondestructive inspection of bonded wafers, packaged semiconductors and industrial products. And we continue to lead the way with new ultrasonic technologies and applications to assure the quality of tomorrow’s innovations.
About Sonix
WAFER INSPECTION
Sonix Wafer Inspection
Bonded Wafers
MEMS Inspection
LED Inspection
Through-Silicon Vias TSV Inspection
Backside Illuminated (BSI) Inspection
PACKAGE INSPECTION
Sonix Package Inspection
Molded Underfill Inspection
Stacked DIE Imaging
Flip Chips
Chip Sale Packages
Ball Grid Arrays
Plastic Encapsulated ICs
Hybrids & Multichip Modules
INDUSTRIAL INSPECTION
Sonix Industrial Inspection
Learn more about Industrial Inspection
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